• 碳化硅二极管sic

    Repetitive peak reverse voltage Average forward current Wafer size Chip thickness Chip size Top Metal Pad size Gross Die
    V A
    E15K761BJ 650 4 4″ 350±20um 1.1mm*1.1mm 0.9mm*0.9mm 4729
    E21K761BJ 650 10 4″ 350±20um 1.84mm*1.84mm 1.6mm*1.6mm 1782
    E21K2311VJ 1200 10 4″ 350±20um 2.2mm*2.2mm 1.95mm*1.95mm 1300
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